Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.

This makes matters even more challenging. We will continue this discussion in our next blog where we will dive further into the use of PID materials to reach the ever-stringent line/space requirements ...

AI-powered applications reshaped the electronics manufacturing landscape in 2024, driving a resurgence for Taiwan’s leading IC substrate makers. Unimicron, Kinsus, and Zhen Ding Tech (ZDT ...

In 2022, the global Laser Direct Imaging (LDI) System for IC Substrates market was valued at US$ 32 million. With increasing demand in downstream markets, the market for Laser Direct Imaging (LDI) ...