To address these challenges, the semiconductor industry is transitioning to Thermocompression Bonding (TCB) for advanced fine-pitch bonding applications, including pitches as small as 10μm. TCB offers ...
More information: Chuan He et al, Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget, Nature Communications (2024). DOI: 10. ...
Surfx Technologies’ Atomflo tm plasma reduces metal oxide using chemistry alone leaving a pristine surface ready for thermocompression bonding or hybrid bonding. Image Credit: Surfx Technologies ...
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