Bowed wafers enter the system at two cassette tilt stations. Wafer handling is via a robot fitted with an edge grip end effector. Wafers are oriented on a notch finder, with wafer ID captured by a ...
It supports various substrate types for 6", 8” and 12" wafers. Its versatile handling system supports wafer thicknesses ...
Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The Proforma 300SA is a semi-automated ...
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What Equipment is Used in Surface Metrology?merge the functionalities of a 300 mm metrology station with a wafer handling system integrated within an Equipment Front End ...
Laser Photonics Corporation (NASDAQ: LASE) ("LPC"), a leading global developer of industrial laser systems for cleaning and ...
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