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IT之家1 月 22 日消息，佳能今日宣布开发出具有 4.1 亿像素（24592 x 16704）的全画幅背照堆叠式 CMOS 传感器，这也是 35mm 全画幅相机中最高纪录。 大家这里只看数字的话对于 4.1 亿像素可能没什么概念，不过我们可以把它当作 24K 分辨率来理解，其像素数约为 FHD 的 ...

Canon has announced a 35mm full-frame CMOS sensor with a mindboggling 410 million pixels, the world's highest pixel count. The newly developed 410-megapixel CMOS sensor has a 24,592 x 16,704-pixel ...

AI isn’t just a tool—it’s the foundation for building competitive advantage. In a recent post, we showed how chief marketing officers (CMOs) can move beyond AI experimentation to prove more value and ...

Here's everything you need to know about the Romanian deadlift, including how to perfect your RDL form, common mistakes, and the difference between a Romanian and conventional deadlift.

集成电路封装是指将制备合格芯片、元件等装配到载体上，采用适当连接技术形成电气连接，安装外壳，构成有效组件的 整个过程，封装主要起着安放、固定、密封、保护芯片，以及确保电路性能和热性能等作用。集成电路封装一般可以分为芯片级封装（0级 ...

The downsizing trend of devices gives rise to continuous demands of increasing input/output (I/O) and circuit density, and these needs encourage the development of a High-Density Fan-Out (HDFO) ...

Pushing the Limits of CMOS RF Technology with N4PRF – Beyond the N6RF technology announced in 2021 ... solution with up to 6 times reticle-size (~5,000mm2) RDL interposer, capable of accommodating 12 ...

Redistribution Layer (RDL) applications require a die sustaining 2 hours at 400°C for interposer in 3D ICs. Fig. 4(a) Cell current variations of 1Mb I-fuse™ at 0.18µm CMOS before and after 1,000hr HTS ...

Chipmakers continue to scale the CMOS transistor to finer geometries, but the question is for how much longer. The current thinking is that the CMOS transistor could scale at least to the 3nm node in ...