The 3M WSS — a complete IGBT and wafer-level packaging solution — combines world-class equipment with 3M™ Liquid UV-Curable Adhesive to enable the temporary bonding and debonding processes required for wafer thinning and …

Using temporary adhesives to bond the processed device wafer to a rigid carrier wafer offers an efficient solution, and is becoming increasingly important in both integrated circuit and MEMS applications, mainly due to its low cost, ease of processing, and adaptability [1-5].

Temporary bonding/debonding enable a variety of advanced IC integration technologies by making a non-permanent bond between a semiconductor wafer and a carrier wafer. The main use of the temporary bonding of a carrier wafer is to provide a support for very thin semiconductor wafers, which are mechanically fragile and will break during handling.

2023年3月31日 · A temporary bonding agent from Fujifilm was used to bond 300 mm wafers. After mechanical grinding, chemical mechanical planarization (CMP) and dry etching, the wafer was thinned to 5.6 μm with an average TTV value of 2.5 μm.

temporary bond adhesive offers robust thermal stability, low outgassing, and excellent mechanical stability, making it suitable for wafer level assembly with a temporary glass carrier. An innovative, solvent-based cleaning solution was also identified to efficiently break down the crosslinked adhesive network, offering a

A highly effective solution is using temporary wafer bonding to minimize stress on silicon wafers during processing. Other benefits to wafer bonding services include protecting wafers from damage during conventional thinning and post-thinning processes, non-damaging adhesives that are easily peeled away, and higher yields.

Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, which are key for 3D IC, power device and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors.

Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors.

In order to successfully handle TSV thin wafers during before dicing, temporary bonder and debonder are one of key process. TEL focus on mechanical debond method. In temporary bonding process, optimization of both material coating and bonding are important. In mechanical debonding process, control of debonding force is important.

Temporary bonding is proving to be a reliable method for handling and processing thin device wafers. In this method, a device wafer is temporarily adhered to a rigid carrier wafer with a polymeric material.